Fabricated Electrical Circuit On Touch Sensor Substrate

ABSTRACT

In one embodiment, a device includes a flexible substrate, a touch sensor made of flexible conductive material disposed on the flexible substrate, and conductive tracks made of flexible conductive material disposed on the flexible substrate. The device also includes an electrical component bonded to the conductive tracks. The conductive tracks electrically couple the electrical component to the touch sensor.

TECHNICAL FIELD

This disclosure generally relates to touch sensors.

BACKGROUND

A touch sensor may detect the presence and location of a touch or theproximity of an object (such as a user's finger or a stylus) within atouch-sensitive area of the touch sensor overlaid on a display screen,for example. In a touch-sensitive-display application, the touch sensormay enable a user to interact directly with what is displayed on thescreen, rather than indirectly with a mouse or touch pad. A touch sensormay be attached to or provided as part of a desktop computer, laptopcomputer, tablet computer, personal digital assistant (PDA), smartphone,satellite navigation device, portable media player, portable gameconsole, kiosk computer, point-of-sale device, or other suitable device.A control panel on a household or other appliance may include a touchsensor.

There are a number of different types of touch sensors, such as (forexample) resistive touch screens, surface acoustic wave touch screens,and capacitive touch screens. Herein, reference to a touch sensor mayencompass a touch screen, and vice versa, where appropriate. When anobject touches or comes within proximity of the surface of thecapacitive touch screen, a change in capacitance may occur within thetouch screen at the location of the touch or proximity. A touch-sensorcontroller may process the change in capacitance to determine itsposition on the touch screen.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an example touch sensor.

FIG. 2A illustrates an example three-dimensional view of touch sensor ofFIG. 1 where touch-sensor controller is bonded to substrate of the touchsensor.

FIGS. 2B-2G illustrate example cross-sectional views of bonding atouch-sensor controller of FIG. 1 to substrate of FIG. 1.

FIG. 3 illustrates another example view of touch sensor of FIG. 1.

FIG. 4 illustrates an example method for bonding an electrical componentto conductive tracks of a touch sensor.

FIG. 5 illustrates an example mesh pattern of a touch-sensitive meshlayer.

DESCRIPTION OF EXAMPLE EMBODIMENTS

FIG. 1 illustrates touch sensor 100. In the example of FIG. 1, touchsensor 100 comprises touch-sensor controller 102. Touch sensor 100 andtouch-sensor controller 102 may detect the presence and location of atouch or the proximity of an object within a touch-sensitive area oftouch sensor 100. Herein, reference to a touch sensor may encompass boththe touch sensor and its touch-sensor controller, where appropriate.Similarly, reference to a touch-sensor controller may encompass both thetouch-sensor controller and its touch sensor, where appropriate. Touchsensor 100 may include one or more touch-sensitive areas, whereappropriate. As an example of FIG. 1 and not by way of limitation, touchsensor 100 may include touch-sensitive area 110. Touch-sensitive area110 may include an array of drive and sense electrodes (or an array ofelectrodes of a single type) disposed on one or more substrates, whichmay be made of a dielectric material. As an example of FIG. 1 and not byway of limitation, touch-sensitive area 110 may be disposed on substrate104. In particular embodiments, the one or more substrates may beflexible. As an example and not by way of limitation, the minimum bendradius for the one or more substrate may be at least approximately 1.5mm. Herein, reference to a touch sensor may encompass both theelectrodes of the touch sensor and the substrate(s) that they aredisposed on, where appropriate. Alternatively, where appropriate,reference to a touch sensor may encompass the electrodes of the touchsensor, but not the substrate(s) that they are disposed on.

An electrode (whether a ground electrode, a guard electrode, a driveelectrode, or a sense electrode) may be an area of conductive materialforming a shape, such as for example a disc, square, rectangle, thinline, other suitable shape, or suitable combination of these. One ormore cuts in one or more layers of conductive material may (at least inpart) create the shape of an electrode, and the area of the shape may(at least in part) be bounded by those cuts. In particular embodiments,the conductive material of an electrode may occupy approximately 100% ofthe area of its shape. As an example and not by way of limitation, anelectrode may be made of indium tin oxide (ITO) and the ITO of theelectrode may occupy approximately 100% of the area of its shape(sometimes referred to as 100% fill), where appropriate. In particularembodiments, the conductive material of an electrode may occupysubstantially less than 100% of the area of its shape. As an example andnot by way of limitation, an electrode may be made of fine lines ofmetal or other conductive material (FLM), such as for example copper,silver, carbon, or a copper-, silver-, or carbon-based material, and thefine lines of conductive material may occupy approximately 5% of thearea of its shape in a hatched, mesh (as described below), or othersuitable pattern. Herein, reference to FLM encompasses such material,where appropriate. Although this disclosure describes or illustratesparticular electrodes made of particular conductive material formingparticular shapes with particular fill percentages having particularpatterns, this disclosure contemplates any suitable electrodes made ofany suitable conductive material forming any suitable shapes with anysuitable fill percentages having any suitable patterns. As an exampleand not by way of limitation, the conductive material(s) of theelectrodes may be flexible.

Where appropriate, the shapes of the electrodes (or other elements) of atouch sensor may constitute in whole or in part one or moremacro-features of the touch sensor. One or more characteristics of theimplementation of those shapes (such as, for example, the conductivematerials, fills, or patterns within the shapes) may constitute in wholeor in part one or more micro-features of the touch sensor. One or moremacro-features of a touch sensor may determine one or morecharacteristics of its functionality, and one or more micro-features ofthe touch sensor may determine one or more optical features of the touchsensor, such as transmittance, refraction, or reflection.

A mechanical stack may contain the substrate (or multiple substrates)and the conductive material forming the drive or sense electrodes oftouch sensor 100. As an example and not by way of limitation, themechanical stack may include a first layer of optically clear adhesive(OCA) beneath a cover panel. The cover panel may be clear and made of aresilient material suitable for repeated touching, such as for exampleglass, polycarbonate, or poly(methyl methacrylate) (PMMA). Thisdisclosure contemplates any suitable cover panel made of any suitablematerial. The first layer of OCA may be disposed between the cover paneland the substrate with the conductive material forming the drive orsense electrodes. The mechanical stack may also include a second layerof OCA and a dielectric layer (which may be made of polyethyleneterephthalate (PET) or another suitable material, similar to thesubstrate with the conductive material forming the drive or senseelectrodes). As an alternative, where appropriate, a thin coating of adielectric material may be applied instead of the second layer of OCAand the dielectric layer. In particular embodiments, the thin coating ofthe dielectric material may be thicker than approximately 3 μm. Inparticular embodiments, the thin coating may possess particular opticalqualities such as for example, smooth and low haze. The second layer ofOCA may be disposed between the substrate with the conductive materialmaking up the drive or sense electrodes and the dielectric layer, andthe dielectric layer may be disposed between the second layer of OCA andan air gap to a display of a device including touch sensor 100. As anexample only and not by way of limitation, the cover panel may have athickness of approximately 1 mm; the first layer of OCA may have athickness of approximately 0.05 mm; the substrate with the conductivematerial forming the drive or sense electrodes may have a thickness ofapproximately 0.05 mm; the second layer of OCA may have a thickness ofapproximately 0.05 mm; and the dielectric layer may have a thickness ofapproximately 0.05 mm. Although this disclosure describes a particularmechanical stack with a particular number of particular layers made ofparticular materials and having particular thicknesses, this disclosurecontemplates any suitable mechanical stack with any suitable number ofany suitable layers made of any suitable materials and having anysuitable thicknesses. As an example and not by way of limitation, inparticular embodiments, a layer of adhesive or dielectric may replacethe dielectric layer, second layer of OCA, and air gap described above,with there being no air gap to the display.

One or more portions of substrate 104 may be made of PET or anothersuitable material. This disclosure contemplates any suitable substratewith any suitable portions made of any suitable material. In particularembodiments, substrate 104 may be made of a low-birefringence material,such as for example, cyclic olefin polymer (COP), cyclic olefincopolymer (COC), cyclic block copolymer (CBC), tri-acetate cellulose(TAC), polyethersulfone (PES), fiber-reinforced plastic (FRP), someforms of polycarbonate, glass (see e.g., fused silica), or any othersuitable material or suitable combination of materials having lowbirefringence. In particular embodiments, the drive or sense electrodesin touch-sensitive area 110 may be made of ITO in whole or in part. Inparticular embodiments, the drive or sense electrodes in touch-sensitivearea 110 may be made of fine lines of metal or other conductivematerial. As an example and not by way of limitation, one or moreportions of the conductive material may be copper or copper-based andhave a thickness of approximately 5 μm or less and a width ofapproximately 10 μm or less. As another example, one or more portions ofthe conductive material may be silver or silver-based and similarly havea thickness of approximately 5 μm or less and a width of approximately10 μm or less. As yet another example, one or more portions of theconductive material may be carbon or carbon-based and similarly have athickness of approximately 5 μm or less and a width of approximately 10μm or less. This disclosure contemplates any suitable electrodes made ofany suitable material.

Touch sensor 100 may implement a capacitive form of touch sensing. In amutual-capacitance implementation, touch-sensitive area 110 may includean array of drive and sense electrodes forming an array of capacitivenodes. A drive electrode and a sense electrode may form a capacitivenode. The drive and sense electrodes forming the capacitive node maycome near each other, but not make electrical contact with each other.Instead, the drive and sense electrodes may be capacitively coupled toeach other across a space between them. A pulsed or alternating voltageapplied to the drive electrode (by touch-sensor controller 102) mayinduce a charge on the sense electrode, and the amount of charge inducedmay be susceptible to external influence (such as a touch or theproximity of an object). When an object touches or comes withinproximity of the capacitive node, a change in capacitance may occur atthe capacitive node and touch-sensor controller 102 may measure thechange in capacitance. By measuring changes in capacitance throughoutthe array, touch-sensor controller 102 may determine the position of thetouch or proximity within touch-sensitive area 110 of touch sensor 100.

In a self-capacitance implementation, touch-sensitive area 110 mayinclude an array of electrodes of a single type that may each form acapacitive node. When an object touches or comes within proximity of thecapacitive node, a change in self-capacitance may occur at thecapacitive node and touch-sensor controller 102 may measure the changein capacitance, for example, as a change in the amount of charge neededto raise the voltage at the capacitive node by a pre-determined amount.As with a mutual-capacitance implementation, by measuring changes incapacitance throughout the array, touch-sensor controller 102 maydetermine the position of the touch or proximity within touch-sensitivearea 110 of touch sensor 100. This disclosure contemplates any suitableform of capacitive touch sensing, where appropriate.

In particular embodiments, one or more drive electrodes may togetherform a drive electrode line running horizontally or vertically or in anysuitable orientation. Similarly, one or more sense electrodes maytogether form a sense electrode line running horizontally or verticallyor in any suitable orientation. Additionally, one or more groundelectrodes may together form a ground electrode line runninghorizontally or vertically or in any suitable orientation, in particularembodiments, drive electrode lines may run substantially perpendicularto sense electrode lines. In particular embodiments, drive electrodelines may run substantially parallel to sense electrode lines. Herein,reference to a drive electrode line may encompass one or more driveelectrodes making up the drive electrode line, and vice versa, whereappropriate. Similarly, reference to a sense electrode line mayencompass one or more sense electrodes making up the sense electrodeline, and vice versa, where appropriate. Additionally, reference to aground electrode line may encompass one or more ground electrodes makingup the ground electrode line, and vice versa, where appropriate, inparticular embodiments, any electrode may be configured as a drive,sense, or ground electrode and the configuration of any electrode may bechanged during operation of touch sensor 100. In particular embodiments,configuration of electrodes may be controlled by touch-sensor controller102.

Touch sensor 100 may have drive and sense electrodes disposed in apattern on one side of a single substrate. In such a configuration, apair of drive and sense electrodes capacitively coupled to each otheracross a space between them may form a capacitive node. For aself-capacitance implementation, electrodes of only a single type may bedisposed in a pattern on a single substrate. In addition or as analternative to having drive and sense electrodes disposed in a patternon one side of a single substrate, touch sensor 100 may have driveelectrodes disposed in a pattern on one side of a substrate and senseelectrodes disposed in a pattern on another side of the substrate.Moreover, touch sensor 100 may have drive electrodes disposed in apattern on one side of one substrate and sense electrodes disposed in apattern on one side of another substrate. In such configurations, anintersection of a drive electrode and a sense electrode may form acapacitive node. Such an intersection may be a location where the driveelectrode and the sense electrode “cross” or come nearest each other intheir respective planes. The drive and sense electrodes do not makeelectrical contact with each other instead they are capacitively coupledto each other across a dielectric at the intersection. Although thisdisclosure describes particular configurations of particular electrodesforming particular nodes, this disclosure contemplates any suitableconfiguration of any suitable electrodes forming any suitable nodes.Moreover, this disclosure contemplates any suitable electrodes disposedon any suitable number of any suitable substrates in any suitablepatterns.

In particular embodiments, touch sensor 100 may determine the positionof an object (such as a stylus or a user's finger or hand) that makesphysical contact with touch-sensitive area 110. In addition or as analternative, in particular embodiments, touch sensor 100 may determinethe position of an object that comes within proximity of touch-sensitivearea 110 without necessarily contacting touch-sensitive area 110. Inparticular embodiments, an object may come within proximity oftouch-sensitive area 110 when it is located some distance above asurface of touch-sensitive area 110; when it hovers in a particularposition above a surface of touch-sensitive area 110; when it makes amotion (such as for example a swiping motion or an air gesture) above asurface of touch-sensitive area 110; or any suitable combination of theabove. In particular embodiments, determining the position of an objectthat comes within proximity of touch-sensitive area 110 without makingphysical contact may be referred to as determining the proximity of anobject. In particular embodiments, determining the proximity of anobject may comprise determining the position of an object's projectiononto touch-sensitive area 110 when the object is located some distanceabove a plane of touch-sensitive area 110. The projection of an objectonto touch-sensitive area 110 may be made along an axis that issubstantially orthogonal to a plane of touch-sensitive area 110. Inparticular embodiments, the position of an object's projection ontotouch-sensitive area 110 may be referred to as the position or thelocation of an object. As an example and not by way of limitation, touchsensor 100 may determine the position of an object when the object islocated above the surface of touch-sensitive area 110 and within adistance of approximately 20 mm of the surface of touch-sensitive area110. Although this disclosure describes or illustrates particular touchsensors 100 that may determine a position of physical contact of anobject, a proximity of an object, or a combination of the two, thisdisclosure contemplates any suitable touch sensor 100 suitablyconfigured to determine a position of physical contact of an object, aproximity of an object, or any suitable combination of one or more ofthe above.

As described above, a change in capacitance at a capacitive node oftouch-sensitive area 110 may indicate a touch or proximity input at theposition of the capacitive node. Touch-sensor controller 102 may detectand process the change in capacitance to determine the presence andlocation of the touch or proximity input. Touch-sensor controller 102may then communicate information about the touch or proximity input toone or more other components (such one or more central processing units(CPUs)) of a device that includes touch sensor 100 and touch-sensorcontroller 102, which may respond to the touch or proximity input byinitiating a function of the device (or an application finning on thedevice). Although this disclosure describes a particular touch-sensorcontroller having particular functionality with respect to a particulardevice and a particular touch sensor, this disclosure contemplates anysuitable touch-sensor controller having any suitable functionality withrespect to any suitable device and any suitable touch sensor.

Touch-sensor controller 102 may be one or more integrated circuits(ICs), such as for example general-purpose microprocessors,microcontrollers, programmable logic devices or arrays,application-specific ICs (ASICs). In particular embodiments,touch-sensor controller 102 comprises analog circuitry, digital logic,and digital non-volatile memory. In particular embodiments, touch-sensorcontroller 102 is disposed on a flexible printed circuit (FPC) bonded toa substrate of touch sensor 100. The FPC may be active or passive, whereappropriate. In other particular embodiments, multiple touch-sensorcontrollers 102 are disposed on the FPC. In yet other particularembodiments, one or more touch-sensor controllers 102 are disposed onsubstrate(s) of touch sensor 100. As an example of FIG. 1 and not by wayof limitation, touch-sensor controller 102 may be disposed on substrate104 of touch sensor 100. Herein, reference to an area of substrate(s)that encompasses one or more touch-sensitive areas may be referred to asa main portion of the substrate(s), and vice versa, where appropriate.Furthermore, reference to an area of substrate(s) that encompasses oneor more touch-sensor controllers may be referred to as a tail portion ofthe substrate(s), and vice versa, where appropriate. Touch-sensorcontroller 102 may include a processor unit, a drive unit, a sense unit,and a storage unit. The drive unit may supply drive signals to the driveelectrodes of touch-sensitive area 110. The sense unit may sense chargeat the capacitive nodes of touch-sensitive area 110 and providemeasurement signals to the processor unit representing capacitances atthe capacitive nodes. The processor unit may control the supply of drivesignals to the drive electrodes by the drive unit and processmeasurement signals from the sense unit to detect and process thepresence and location of a touch or proximity input withintouch-sensitive area 110 of touch sensor 100. The processor unit mayalso track changes in the position of a touch or proximity input withintouch-sensitive area 110 of touch sensor 100. The storage unit may storeprogramming for execution by the processor unit, including programmingfor controlling the drive unit to supply drive signals to the driveelectrodes, programming for processing measurement signals from thesense unit, and other suitable programming, where appropriate. Althoughthis disclosure describes a particular touch-sensor controller having aparticular implementation with particular components, this disclosurecontemplates any suitable touch-sensor controller having any suitableimplementation with any suitable components.

Tracks 108 may be made of conductive material disposed on substrate 104.Tracks 108 may come in different widths. In particular embodiments,tracks 108 may be made of flexible conductive material. As an exampleand not by way of limitation, the minimum bend radius for the flexibleconductive material may be at least approximately 1.5 mm. Wider tracksmay be used to form bonding pads for mounting electrical component onsubstrate 104. Herein, reference to tracks may encompass bonding pads,and vice versa, where appropriate. Moreover, tracks 108 may couplevarious components of touch sensor 100. As an example of FIG. 1 and notby way of limitation, tracks 108 may couple the drive or senseelectrodes of touch-sensitive area 110 to touch-sensor controller 102,also disposed on substrate 104. Tracks 108 may also couple touch-sensorcontroller 102 to connection pads 106, also disposed on substrate 104.In particular embodiments, tracks 108 may even couple the drive or senseelectrodes of touch-sensitive area 110 to connection pads 106 directly.As described below, connection pads 16 facilitate coupling of tracks 108to one or more other components (such one or more central processingunits (CPUs)) of a device that includes touch sensor 100.

Tracks 108 may extend into or around (e.g. at the edges of)touch-sensitive area 110 of touch sensor 100. Tracks 108 may providedrive connections for coupling touch-sensor controller 102 to driveelectrodes of touch-sensitive area 110, through which the drive unit oftouch-sensor controller 102 may supply drive signals to the driveelectrodes. Other tracks 108 may provide sense connections for couplingtouch-sensor controller 102 to sense electrodes of touch-sensitive area110, through which the sense unit of touch-sensor controller 102 maysense charge at the capacitive nodes of touch-sensitive area 110. Tracks108 may be made of fine lines of metal or other conductive material. Asan example and not by way of limitation, the conductive material oftracks 108 may be copper or copper-based and have a width ofapproximately 100 μm or less. As another example, the conductivematerial of tracks 108 may be silver or silver-based and have a width ofapproximately 100 μm or less. As yet another example, the conductivematerial of tracks 108 may be carbon or carbon-based and have a width ofapproximately 100 μm or less. In particular embodiments, tracks 108 maybe made of ITO in whole or in part in addition or as an alternative tofine lines of metal or other conductive material. Although thisdisclosure describes particular tracks made of particular materials withparticular widths, this disclosure contemplates any suitable tracks madeof any suitable materials with any suitable widths. In addition totracks 108, touch sensor 100 may include one or more ground electrodelines terminating at a ground connector (which may be a connection pad106) at an edge of substrate 104 (similar to tracks 108).

Connection pads 16 may be located along one or more edges of substrate104 of touch sensor 100. As described above, touch-sensor controller 102may be on substrate 104. Connection pads 106 may be made of the samematerial as tracks 108. In particular embodiments, connection pads 16may be connected to an electro-mechanical connector (such as azero-insertion-force (ZIF) wire-to-board connector). This disclosurecontemplates any suitable connector between touch sensor 100 and one ormore other components (such one or more central processing units (CPUs))of a device that includes touch sensor 100.

FIG. 2A (not necessarily shown to scale) illustrates an examplethree-dimensional view of touch sensor 100 where touch-sensor controller102 is bonded to substrate 104 of touch sensor 100. In the example ofFIG. 2A, touch sensor 100 comprises a single-layer configuration withelectrodes disposed only on one surface of the flexible substrate. Asanother example and not by way of limitation, touch sensor 100 maycomprise a double-layer configuration with one or more electrodesdisposed on first surface of the flexible substrate and one or moreelectrodes disposed on a second surface of the flexible substrateopposite the first surface. Touch sensor 100 having a double-layerconfiguration may comprise one or more vias. Vias are electricallyconductive openings made through substrate 104, through which tracks 108may pass, so that they may continue along the opposite surface ofsubstrate 104 from the electrodes. As an example and not by way oflimitation, one or more electrically conductive vias disposed throughsubstrate 104 may electrically couple conductive material formed on anoutward-facing surface of substrate 104 with conductive material formedon an inward-facing surface of substrate 104. As another example and notby way of limitation, touch-sensor 100 may be encapsulated between aglass cover panel and a second dielectric layer (which may be made ofpolyethylene terephthalate (PET) or another suitable material, similarto the substrate with the conductive material forming the drive or senseelectrodes). Accordingly, vias may be formed under the glass cover panelwhere the glass cover panel acts as an environmental barrier for thevias. As such, the vias may electrically couple conductive material(i.e. tracks 108) on one side of a substrate (where touch-sensorcontroller 102 is located) to the other side of the substrate. As anexample and not by way of limitation, the vias may electrically coupletracks 108 from the side of substrate 104 closest to the glass coverpanel to the opposite side of substrate 104 where touch-sensorcontroller 102 is bonded to substrate 104. Although this disclosuredescribes vias for electrically coupling conductive materials betweenparticular surfaces of substrate 104, this disclosure contemplates anysuitable electrical interconnects for electrically coupling conductivematerials between any suitable surfaces of any suitable substrate of anysuitable touch sensor in any suitable manner.

In particular embodiments, substrate 104 may be made of PET, asdescribed above. In other embodiments, substrate 104 may be made of alow-birefringence material, as further described above. Furthermore,substrate 104 may possess a particular thickness. As an example and notby way of limitation, the thickness of substrate 104 may besubstantially equivalent to 50 μm. As another example and not by way oflimitation, the thickness of substrate 104 may be substantially between50 μm and 200 μm. Although this disclosure describe particular substrateof touch sensor 100 in a particular manner, this disclosure contemplatesany suitable substrate of touch sensor 100 made of any suitablecombination of one or more of any suitable material in any suitablemanner.

In the example of FIG. 2A, tracks 108 of conductive material mayinterconnect various components of touch sensor 100. Furthermore, tracks108 may encompass traces (not shown in FIG. 2A) and bonding pads. Tracesmay primarily deliver current between various electrical components onsubstrate 104. In addition to delivering current between variouselectrical components on substrate 104, bonding pads may bond electricalcomponents to substrate 104. As an example of FIG. 2A and not by way oflimitation, bonding pads 204 may bond the pins of touch-sensorcontroller 102 to substrate 104. The pins of touch-sensor controller 102may comprise input/output (I/O) pins and power pins. In particularembodiments, bonding pads may be formed from tracks 108. As an exampleof FIG. 2A and not by way of limitation, bonding pads 204 may be formedof the same conductive material as tracks 108 and may possesspre-determined widths and thicknesses. As another example of FIG. 2A andnot by way of limitation, bonding pads 204 may be substantially widerand thicker than traces of tracks 108 for better conductivity with andmechanical support of the bonded electrical component(s). In particularembodiments, the traces and bonding pads 204 may be made of FLM, asdescribed above. In other particular embodiments, at least some of theconductive material is copper, silver, carbon, copper-based,silver-based, or carbon-based, as further described above. Although thisdisclosure describes and illustrates tracks 108 of touch sensor 100comprising particular traces and particular bonding pads, the disclosurecontemplates tracks 108 of touch sensor 100 comprising any suitablecombination of one or more suitable electrical interconnects. Moreover,although this disclosure describes and illustrates particular bondingpads for bonding electrical components to substrate 104 in a particularmanner, this disclosure contemplates any suitable electricalinterconnects for bonding electrical components to any suitablesubstrate of any suitable touch sensor in any suitable manner. As anexample and not by way of limitation, traces of tracks 108 may be usedto bond the electrical components to substrate 104.

In the example of FIG. 2A, bonding pads 204 may be bonded to the pins oftouch-sensor controller 102. As such, bonding pads 204 may be arrangedon substrate 104 in a pattern associated with the pins of touch-sensorcontroller 102. As an example of FIG. 2A and not by way of limitation,touch-sensor controller 102 has a quad-flat no-leads (QFN) packagingfootprint. As such, bonding pads 204 may be arranged in association withthe QFN packaging footprint. As another example and not by way oflimitation, touch-sensor controller 102 (or any other active electricalcomponent) may have a ball-grid array (BGA) packaging footprint. Assuch, bonding pads 204 may be arranged in association with the BGApackaging footprint. In addition, bonding pads 204 may be bonded to thepins of touch-sensor controller 102 using an anisotropic conductive film(ACF) 202. ACE 202 is a heat-treatable and electrically conductiveadhesive film used for coupling various components electrically andmechanically. ACE 202 may contain conductive particles of variousparticle sizes and distributions within an epoxy-based resin. Theconductive particles may be configured to form electrical interconnectswithin certain parts of the adhesive film. The conductive particles mayalso be configured to be electrically insulating in other parts of theadhesive firm. In the example of FIG. 2A, ACF 202 may be trimmed toparticular shape and size associated with one or more features of theelectrical component to be bonded (such as for example square-outline oftouch-sensor controller 102 encompassing the pins). Accordingly, asindicated by arrow 208, ACF 202 may be pressed on substrate 104 and theassociated bonding pads 204. Next, as indicated by arrow 206,touch-sensor controller 102 may be pressed on ACF 202 where each pin (oftouch-sensor controller 102) may be properly aligned with the associatedbonding pad 204 on substrate 104. Although this disclosure describes andillustrates ACF 202 for bonding particular electrical component toparticular substrate of particular touch sensor, this disclosurecontemplates any suitable adhesive and conductive material for bondingany suitable electrical component to any suitable substrate of anysuitable touch sensor in any suitable manner. As an example and not byway of limitation, anisotropic conductive paste (ACP) may be used tobond touch-sensor controller 102 to substrate 104. ACP may be formedfrom the main ingredient materials of ACE 202. As such, ACP may sharecertain key characteristics of ACF 202, such as for example adhesivenessand electrically conductive (in configurable sub-portions). Furthermore,ACP may exist in paste form at room temperature. Accordingly, ACP may beselectively applied (such as for example, screen printed) to particularportions of substrate 104 (such as for example bonding pads 204) forbonding substrate 104 with touch-sensor controller 102. As anotherexample and not by way of limitation, a conductive epoxy-base resin,such as for example silver-filled epoxy, may be used for bondingtouch-sensor controller 102 to substrate 104.

Moreover, although this disclosure describes and illustratestouch-sensor controller 102 being bonded to particular tracks andparticular substrate of touch sensor 100, this disclosure contemplatesany suitable electrical component being bonded to any suitable tracksand any suitable substrate (associated with the tracks) of any suitabletouch sensor. The electrical component being bonded may comprise anactive electrical component, a passive electrical component, or even athird-party printed circuit board (PCB) or FPC. In particularembodiments, the active electrical component as bonded may require oneor more vias in the substrate. The number of vias may depend at least ona pin (such as for example, signal pin and power pin) density of thebonded active electrical component, type of pins of the bonded activeelectrical component, a component density on substrate 104, size ofsubstrate 104, or configuration of the active electrical component. Asan example of an active electrical component and by way of limitation,any suitable integrated circuit (IC) encased in packaging with pins forelectrically coupling the IC to the conductive tracks may beelectrically and mechanically bonded to the tracks and associatedsubstrate. As an example of a passive electrical component and by oflimitation, any suitable discrete component (such as for example acapacitor or a resistor) may be electrically and mechanically bonded tothe tracks and associated substrate. In particular embodiments, tracks108 may be configured to comprise a pattern of interleaving fingers withvery small separation between the fingers as interleaved. As an exampleand not by way of limitation, a power decoupling capacitor may be bondedto two of the interleaved fingers as described above. As another exampleand not by way of limitation, the size of the separation between any twoneighboring interleaved fingers may depend at least on a packagingfootprint descriptor of the discrete component (such as for example0402, 0603, or 0805). As another example of a passive electricalcomponent and by way of limitation, any suitable electrical connectormay be electrically and mechanically bonded to the tracks and associatedsubstrate. In particular embodiments, the electrical connector may bebonded to tracks 108 at an edge of substrate 104. As an example and notby way of limitation, the electrical connector may be a flexible ribboncable bonded to substrate 104 using ACF 202.

Touch-sensor controller 102 may be bonded to a pre-determined portion ofsubstrate 104 of touch sensor 100. As an example of FIG. 2A and not byway of limitation, touch-sensor controller 102 may be bonded to atail-end portion of substrate 104 of touch sensor 100. At the same time,the main portion of touch sensor 100 may be located above a display (notshown in FIG. 2A) of a device comprising touch sensor 100, in particularembodiments, the tail-end portion of touch sensor 100 may comprisetouch-sensor controller 102 and other associated electrical componentsthat are bonded to substrate 104 of touch sensor 100. As such,touch-sensor controller 102 and the other associated electricalcomponents may form electrical circuitry in addition to the electrodesof touch sensor 100. In other particular embodiments, the tail-endportion of touch sensor 100 may be bonded to an external PCB, anexternal FPC, or a flexible ribbon cable, as described above. In yetother particular embodiments, the tail-end portion of touch sensor 100may be clamped to an external ZIF connector. Although this disclosuredescribes and illustrates particular electrical component(s) beingbonded to particular portion of substrate 104 of touch sensor 100, thisdisclosure contemplates any suitable electrical component(s) beingbonded to one or more of any suitable portions of substrate 104 of touchsensor 100 in any suitable manner.

In particular embodiments, bonding electrical component(s) (such as forexample touch-sensor controller 102) directly to substrate of any touchsensor may reduce overall cost of the touch-sensor assembly. As anexample of FIG. 2A and not by way of limitation, bonding touch-sensorcontroller 102 and its associated electrical components directly tosubstrate 104 of touch sensor 100, instead of bonding touch-sensorcontroller 102 and the associated electrical components to an externalPCB (or FPC) and attaching the external PCB (or FPC) to touch sensor100, may reduce component count of the touch-sensor assembly by removingthe external PCB (or FPC), Furthermore, the reduced component count mayreduce an overall cost and associated manufacturing costs of thetouch-sensor assembly. In particular embodiments, bonding electricalcomponent(s) (such as for example touch-sensor controller 102) directlyto substrate of any touch sensor may improve performance of the touchsensor. As an example of FIG. 2A and not by way of limitation, theimprovement in performance of touch sensor 100 may be accomplished byreducing travel distance of electrical currents between touch-sensorcontroller 102 and various associated electrical components on touchsensor 100. The shorter travel distance of electrical currents mayreduce charge times and electrical noise (as imposed on interconnectsbetween touch-sensor controller 102 and its associated electricalcomponents of touch sensor 100). As another example of FIG. 2A and notby way of limitation, the improvement in performance of touch sensor maybe accomplished by reducing a number of intermediate electricalcomponents between touch-sensor controller 102 and various otherassociated electrical components on touch sensor 100. In particularembodiments, the reduced component count of the touch-sensor 100assembly, as described above, may realize a compact touch sensor 100assembly. Although this disclosure describes and illustrates particularbenefits of bonding particular electrical component(s) directly tosubstrate 104 of touch sensor 100, this disclosure contemplates anysuitable benefits of bonding the electrical component(s) directly to anysuitable substrate of any suitable touch sensor in any suitable manner.

FIGS. 2B-2G (not necessarily shown to scale) illustrate examplecross-sectional views of bonding touch-sensor controller 102 to adouble-sided substrate 104. In the example of FIG. 2B, tracks 108 ofconductive material forming bonding pads 204 may be disposed on atop-side of substrate 104. In particular embodiments, bonding pads 204may be disposed on a pre-determined portion of the top-side of substrate104. As an example of FIG. 2A and not by way of limitation, thepre-determined portion of substrate 104 may be a tail portion ofsubstrate 104, as described above. Furthermore, bonding pads 204 may bedisposed using a pre-determined pattern on substrate 104, as describedabove. As an example of FIG. 2A and not by way of limitation, thepre-determined pattern may be associated with the pins and outline oftouch-sensor controller 102. As an example of FIGS. 2B-2G and not by wayof limitation, touch-sensor controller 102 has a QFN packaging footprintand bonding pads 204 may be arranged in association with the QFNpackaging footprint. As another example and not by way of limitation,touch-sensor controller 102 (or any other active electrical component)may have a BGA packaging footprint and bonding pads 204 may be arrangedin association with the BGA packaging footprint. In the example of FIG.2C, ACF 202 may be disposed on bonding pads 204. In particularembodiments, a shape and a size of ACF 202 as applied may depend atleast on the pre-determined pattern of bonding pads 204 as disposed. Inthe example of FIG. 2D, touch-sensor controller 102 comprising theassociated packaging 102A and pins 102B may be disposed on ACF 202. Inparticular embodiments, touch-sensor controller 102 may be disposed suchthat pins 102B may be aligned with associated bonding pads 204 onsubstrate 104. In the example of FIG. 2E, a combination of at least apre-determined pressure and pre-determined elevated temperature cycles212 may be applied on touch-sensor controller 102 in a controlledenvironment. Application of the pre-determined pressure 212 may allowconductive particles of ACF 202 to form electrical interconnects 210between pins 102B of touch-sensor controller 102 and associated bondingpads 204. As an example and not by way of limitation, the pre-determinedpressure 212 may be approximately 3 Megapascals (MPa), Electricalinterconnects 210 may allow for flow of electrical current between pins102B and associated bonding pads 204 anisotropically. Furthermore,application of the pre-determined elevated temperature cycles 212 mayallow the epoxy constituent of ACF 202 to reflow and form an adhesivebridge joining touch-sensor controller 102 to the associated bondingpads 204 and substrate 104. As an example and not by way of limitation,the pre-determined elevated temperature cycles 212 may be applied totouch-sensor controller 102 at approximately 150° C. (i.e. within arange of 140° C. to 190° C.). In the example of FIG. 2F, a stiffener 214is applied to a bottom-side of substrate 104. Furthermore, the stiffener214 may be located substantially opposite to touch-sensor controller 102(with respect to substrate 104). In particular embodiments, excessiveflexure, strain, or twist of ACF 202 between touch-sensor controller 102and substrate 104 may cause bond pads 204 to delaminate from pins 102Bof touch-sensor controller 102. As an example and not by way oflimitation, referencing FIG. 2F, applying stiffener 214 to thebottom-side of substrate 104 may substantially minimize such flexure,strain, or twist of ACF 202. Furthermore, stiffener 214 may provide anenvironmental barrier to prevent water from diffusing through substrate104 from the bottom-side of substrate 104 and affecting a structuralintegrity of ACF 202. In the example of FIG. 2G, touch-sensor controller102 may be encapsulated by encapsulant 216. In particular embodiments,the encapsulant 216 may include any suitable combination of one or moreof epoxy-, silicone-, and polyamide-based materials. In particularembodiments, depending on pre-determined requirements of adhesion,protection, and accessibility with regards to touch-sensor 102,encapsulant 216 may cover the entire or selected areas of touch-sensorcontroller 102. As an example and not by way of limitation, in order toincrease adhesion between touch-sensor controller 102 and substrate 104(a.k.a. reduce stress on ACF 202) and provide an environmental barrierat all sides of touch-sensor controller 102, encapsulant 216 may coverthe entire touch-sensor controller 102. In particular embodiments,encapsulant 216 may be optically opaque or clear. As an example, anoptically-clear encapsulant 216 may allow touch-sensor controller 102 tobe visually inspected. Furthermore, carbon-based ink (not shown in thefigures) may be printed over the exposed tracks 108 and bonding pads204. Such carbon-based ink may provide an additional conductive,corrosion-resistance, and environmental stable coating over the tracks108 and bonding pads 204. Although this disclosure describes andillustrates particular steps of bonding touch-sensor controller 102 tosubstrate 104 of touch sensor 100, this disclosure contemplates anysuitable combination of one or more suitable steps of bonding anysuitable touch-sensor controller to any suitable substrate of anysuitable touch sensor in any suitable manner. Moreover, although thisdisclosure describes and illustrates particular components, devices, orsystems carrying out particular steps of FIGS. 2B-2G, this disclosurecontemplates any suitable combination of any suitable components,devices, or systems carrying out any suitable steps of FIGS. 2B-2G.

FIG. 3 (not necessarily shown to scale) illustrates another example viewof touch sensor 100. In the example of FIG. 3, touch-sensor controller102 is bonded on substrate 104 and tracks 108 extend outwards from pins102B of touch-sensor controller 102 to connect to various othercomponents on touch sensor 100. As an example of FIG. 3 and not by wayof limitation, a first portion of tracks 108 from pins 102B may beconnected to connection pads 106. As another example of FIG. 3 and notby way of limitation, a second portion of tracks 108 from pins 102B maybe connected to electrodes in touch-sensitive area 110 (not shown inFIG. 3) of touch sensor 100. Although this disclosure describes andillustrates particular layout of particular electrical components andparticular tracks on substrate 104 of touch sensor 100, this disclosurecontemplates any suitable layout of any suitable combination of one ormore of any suitable electrical component and any suitable combinationof one or more of any suitable track on any suitable substrate of anysuitable touch sensor.

FIG. 4 illustrates example method 400 for bonding an electricalcomponent to conductive tracks of a touch sensor. In step 402 of FIG. 4,flexible conductive material is disposed on a flexible substrate. As anexample and not by way of limitation, the flexible conductive materialmay be made of for example copper, silver, carbon, or a copper-,silver-, or carbon-based material, as described above. As anotherexample and not by way of limitation, the flexible substrate may be madeof PET or a material having a low birefringence, as described above. Inparticular embodiments, one or more flexible conduction materials may bedisposed on the flexible substrate. As an example and not by way oflimitation, the one or more flexible conductive materials may be made ofany suitable combination of one or more of an ITO, copper, silver,carbon, or a copper-, silver-, or carbon-based material. In otherparticular embodiments, one or more flexible conductive material may bedisposed on multiple substrate(s). In step 404 of FIG. 4, a touch sensoris formed on the flexible substrate with a first portion of the flexibleconductive material. As an example of FIG. 1 and not by way oflimitation, touch sensor 100 may be formed on flexible substrate 104. Asanother example of FIG. 1 and not by way of limitation, touch sensor 100may comprise touch-sensitive area 110 as disposed on flexible substrate104. Touch-sensitive area 110 may include an array of drive and senseelectrodes (or an array of electrodes of a single type), as describedabove. Furthermore, the array of drive and sense electrodes may form thefirst portion of the flexible conductive material. In particularembodiments, the drive or sense electrodes in touch-sensitive area 110may be made of ITO in whole or in part. In other particular embodiments,the drive or sense electrodes in touch-sensitive area 110 may be made ofFLM, as described above. In step 406 of FIG. 4, conductive tracks areformed on the flexible substrate with a second portion of the flexibleconductive material. As an example of FIG. 1 and not by way oflimitation, tracks 108 may be formed on flexible substrate 104. Tracks108 may be used for coupling various components associated with touchsensor 100. Tracks 108 may even form bonding pads 104 for electricallyand mechanically bonding external electrical component(s) to substrate104, as described above. As an example of FIG. 1 and not by way oflimitation, tracks 108 may couple the array of drive and senseelectrodes of touch-sensitive area 110 in touch sensor 100 to bondedtouch-sensor controller 102. As another example of FIG. 1 and not by wayof limitation, tracks 108 may couple bonded touch-sensor controller 102to connection pads 106. As yet another example and not by way oflimitation, the flexible conductive material may be made of FLM asdescribed above; and the array of drive and sense electrodes may beformed from the first portion of the flexible conductive material asdescribed above, in contrast, tracks 108 may be formed from the secondportion of the flexible conductive material. In step 408 of FIG. 4, anelectrical component is bonded to the conductive tracks. As an exampleof FIG. 2 and not by way of limitation, the electrical component may betouch-sensor controller 102. In particular embodiments, the conductivetracks electrically couple the electrical component to the touch sensorin step 404. As an example of FIG. 2 and not by way of limitation,tracks 108 form bonding pads 204 and touch-sensor controller 102 may bebonded to bonding pads 204. As another example of FIGS. 2B-2G and not byway of limitation, the flexible substrate 104 is double-sided andtouch-sensor controller 102 may be bonded to tracks 108 that extendalong a top-side of the flexible substrate 104. In particularembodiments, a carbon-based ink (or any other suitable ink) may be usedas a coating over tracks 108, connection pads 106, and bonding pads 204that are substantially exposed to environmental elements such as, forexample moisture and oxygen. The carbon-based ink coating may provide anadditional conductive, corrosion-resistance, and environmental stablecoating for the tracks 108, connection pads 106, and bonding pads 204,as described above. In particular embodiments, touch-sensor controller102 may be bonded to bonding pads 204 and substrate 104 using anadhesive and anisotropic conductive material such as ACF 202, asdescribed above. In particular embodiments, referencing FIG. 2E, apre-determined pressure and one or more elevated temperature cycles 212may be applied to touch-sensor controller 102 to form mechanical andelectrical bonds between pins 102B of touch-sensor controller 102 andbonding pads 204. In particular embodiments, referencing FIG. 2F, astiffener may be applied to a bottom-side of the flexible substrate. Thestiffener may provide an environmental barrier to prevent water fromdiffusing through substrate 104 from the bottom-side of substrate 104and affecting a structural integrity of ACF 202. In particularembodiments, In particular embodiments, the electrical component may beencapsulated. As an example of FIG. 20 and not by way of limitation, theelectrical component may be encapsulated by encapsulant 216. Inparticular embodiments, the encapsulant 216 may include any suitablecombination of one or more of epoxy-, silicone-, and polyamide-basedmaterials, as described above. Although this disclosure describes andillustrates particular steps of bonding particular electrical componentto particular conductive tracks of particular touch sensor, thisdisclosure contemplates any suitable combination of one or more of asuitable step of bonding any suitable electrical component to anysuitable conductive tracks of any suitable touch sensor in any suitablemanner. Moreover, although this disclosure describes and illustratesparticular components, devices, or systems carrying out particular stepsof FIG. 4, this disclosure contemplates any suitable combination of anysuitable components, devices, or systems carrying out any suitable stepsof FIG. 4.

FIG. 5 illustrates an example mesh pattern of a touch-sensitive meshlayer. As discussed above, an electrode may be made of fine lines 22A-Bof metal or other conductive material (for example, copper, silver,carbon, or a copper-, silver-, or carbon-based material) and the lines22A-B of conductive material may occupy the area of the electrode shapein a hatched, mesh, or other suitable pattern. In the example of FIG. 5,an example mesh pattern 20 of a touch-sensitive mesh layer is formedfrom substantially straight lines 22A-B of conductive material. Meshpattern 20 may be formed using two sets 22A-B of substantially parallellines of conductive material. Mesh pattern 20 may also be made up of anarray of polygon-shaped mesh cells 24 formed from substantiallyorthogonal intersections between lines 22A with lines 22B of conductivematerial. In particular embodiments, first set 22A and second set 22B ofconductive lines may be disposed such that a total line density is lessthan approximately 10% of a surface area. Thereof, the contribution ofthe conductive lines to the reduction of transmission of light throughmesh pattern 20 may be less than approximately 10%. In particularembodiments, the conductive lines may result in at an attenuation of,for example, 3-10% of the transmission of light through mesh pattern 20.

In the example of FIG. 5, example mesh pattern 20 of the touch-sensitivemesh layer further includes one or more conductive lines 22A-B that havea width that is greater than a width of one or more other conductivelines 22A-B. As an example and not by way of limitation, mesh pattern 20may include a conductive line 26 and a conductive line 27 (which areexamples of two of conductive lines 22A-B). Conductive line 26 may havea width that is greater than the width of conductive line 27. Inparticular embodiments, conductive line 27 may have any width that isless than the width of conductive line 26. As an example and not by wayof limitation, if the width of conductive line 26 is 5 μm, conductiveline 27 may have any width that is less than 5 μm, such as 4 μm, 3 μm, 2μm, or any other width that is less than 5 μm. In particularembodiments, because conductive line 27 has a width that is less thanthe width of conductive line 26, the total line density of example meshpattern 20 may be reduced. As such, the reduced width of conductive line27 may increase the transmittance in a device utilizing example meshpattern 20.

In the example of FIG. 5, example mesh pattern 20 of a touch-sensitivemesh layer further includes one or more electrodes, such as, forexample, electrode 28. In particular embodiments, electrode 28 mayinclude a plurality of conductive lines 22A-B. Furthermore, inparticular embodiments, one or more of the conductive lines 22A-B may beprimary conductive lines while one or more of the conductive lines 22A-Bmay be secondary conductive lines. In particular embodiments, the widthof the secondary conductive lines may be less than that of the primaryconductive lines. As an example and not by way of limitation, conductiveline 26 (which may have a width that is greater than that of conductiveline 27) may be a primary conductive line, while conductive line 27 maybe a secondary conductive line. In particular embodiments, since theprimary conductive lines have a greater width than that of the secondaryconductive lines, if one or more of the secondary conductive lines break(or are otherwise unable to carry an alternating voltage or charge), theprimary conductive lines and the remaining secondary conductive linesmay still carry the alternating voltage applied to a drive electrode orthe charge induced on a sense electrode. As such, the primary conductivelines and remaining secondary conductive lines may still provide asuitable level of electrical connectivity across mesh pattern 20.Electrode 28 may have any suitable pattern for the primary conductivelines and secondary conductive lines. As an example and not by way oflimitation, the primary conductive lines of electrode 28 may be theoutermost conductive lines of electrode 28, while the secondaryconductive lines of electrode 28 may be the innermost conductive linesof electrode 28.

Although this disclosure describes or illustrates particular meshpatterns, this disclosure contemplates any suitable mesh pattern formedusing conductive lines with any suitable configuration. As an exampleand not by way of limitation, a mesh pattern may include any particularpattern of conductive lines, any particular pattern of primaryconductive lines, any particular pattern of secondary conductive lines,and any particular pattern of electrodes.

Herein, reference to a computer-readable non-transitory storage mediumor media may include one or more semiconductor-based or other integratedcircuits (ICs) (such, as for example, a field-programmable gate array(FPGA) or an application-specific IC (ASIC)), hard disk drives (HDDs),hybrid hard drives (HHDs), optical discs, optical disc drives (ODDs),magneto-optical discs, magneto-optical drives, floppy diskettes, floppydisk drives (FDDs), magnetic tapes, solid-state drives (SSDs),RAM-drives, SECURE DIGITAL cards, SECURE DIGITAL drives, any othersuitable computer-readable non-transitory storage medium or media, orany suitable combination of two or more of these, where appropriate. Acomputer-readable non-transitory storage medium or media may bevolatile, non-volatile, or a combination of volatile and non-volatile,where appropriate.

Herein, “or” is inclusive and not exclusive, unless expressly indicatedotherwise or indicated otherwise by context. Therefore, herein, “A or B”means “A, B, or both,” unless expressly indicated otherwise or indicatedotherwise by context. Moreover, “and” is both joint and several, unlessexpressly indicated otherwise or indicated otherwise by context.Therefore, herein, “A and B” means “A and B, jointly or severally,”unless expressly indicated otherwise or indicated otherwise by context.

The scope of this disclosure encompasses all changes, substitutions,variations, alterations, and modifications to the example embodimentsdescribed or illustrated herein that a person having ordinary skill inthe art would comprehend. The scope of this disclosure is not limited tothe example embodiments described or illustrated herein. Moreover,although this disclosure describes and illustrates respectiveembodiments herein as including particular components, elements,functions, operations, or steps, any of these embodiments may includeany combination or permutation of any of the components, elements,functions, operations, or steps described or illustrated anywhere hereinthat a person having ordinary skill in the art would comprehend.Furthermore, reference in the appended claims to an apparatus or systemor a component of an apparatus or system being adapted to, arranged to,capable of, configured to, enabled to, operable to, or operative toperform a particular function encompasses that apparatus, system,component, whether or not it or that particular function is activated,turned on, or unlocked, as long as that apparatus, system, or componentis so adapted, arranged, capable, configured, enabled, operable, oroperative.

What is claimed is:
 1. A device comprising: a flexible substrate; atouch sensor comprising flexible conductive material disposed on theflexible substrate; conductive tracks comprising flexible conductivematerial disposed on the flexible substrate; and an electrical componentbonded to the conductive tracks, wherein the conductive trackselectrically couple the electrical component to the touch sensor.
 2. Thedevice of claim 1, wherein the flexible substrate comprises polyethyleneterephthalate (PET).
 3. The device of claim 1, wherein the electricalcomponent is bonded to the conductive tracks using at least one ofanisotropic conductive paste (ACP), anisotropic conductive film (ACE),and conductive epoxy.
 4. The device of claim 1, wherein the electricalcomponent is an integrated circuit (IC) encased in packaging, andwherein pins for electrically coupling the IC to the conductive tracksextend outside the packaging.
 5. The device of claim 1, wherein theelectrical component is a touch-sensor controller.
 6. The device ofclaim 1, wherein the electrical component is an active electricalcomponent.
 7. The device of claim 1, wherein the electrical component isa passive electrical component.
 8. The device of claim 1, wherein atleast some of the flexible conductive material comprises a mesh ofconductive lines.
 9. The device of claim 1, wherein at least some of theconductive material is copper, silver, carbon, copper-based,silver-based, or carbon-based.
 10. The device of claim 1, wherein thetouch sensor comprises a single-layer configuration with electrodesdisposed only on one surface of the flexible substrate.
 11. The deviceof claim 1, wherein the touch sensor comprises a double-layerconfiguration with one or more electrodes disposed on a first surface ofthe flexible substrate and one or more electrodes disposed on a secondsurface of the flexible substrate opposite the first surface.
 12. Thedevice of claim 1, further comprising a via in the flexible substratefor coupling the electrical component to a first surface of the flexiblesubstrate and to a second surface of the flexible substrate opposite thefirst surface.
 13. The device of claim 1, wherein: the flexiblesubstrate comprises a main portion and a tail portion; the touch sensoris located in the main portion of the flexible substrate; and theelectrical component is bonded to the conductive tracks in the tailportion of the flexible substrate.
 14. The device of claim 1, wherein atleast some of the conductive tracks comprise a plurality of bondingpads.
 15. A method comprising: disposing flexible conductive material ona flexible substrate, wherein the flexible substrate is double-sided;forming a touch sensor on the flexible substrate with a first portion ofthe flexible conductive material; forming conductive tracks on theflexible substrate with a second portion of the flexible conductivematerial; and bonding an electrical component to the conductive tracks,wherein the conductive tracks: electrically couple the electricalcomponent to the touch sensor; and extend along a first side of theflexible substrate.
 16. The method of claim 15, wherein the flexiblesubstrate comprises polyethylene terephthalate (PET).
 17. The method ofclaim 15, wherein the electrical component is bonded to the conductivetracks using at least one of anisotropic conductive paste (ACP),anisotropic conductive film (ACT), and conductive epoxy.
 18. The methodof claim 15, wherein the electrical component is an integrated circuit(IC) encased in packaging, and wherein pins for electrically couplingthe IC to the conductive tracks extend outside the packaging.
 19. Themethod of claim 15, wherein bonding the electrical component to theconductive tracks comprises: applying, between the electrical componentand the conductive tracks, at least one of ACP, ACF, and conductiveepoxy; applying a pre-determined pressure and one or more pre-determinedelevated temperature cycles to the electrical component; applying astiffener to a second side of the flexible substrate, wherein thestiffener is located substantially opposite to the electrical component;and encapsulating the electrical component.
 20. A device comprising: aflexible substrate; a touch sensor comprising flexible conductivematerial disposed on the flexible substrate, at least a portion of theflexible conductive material comprising a mesh of conductive lines;conductive tracks comprising flexible conductive material disposed onthe flexible substrate; and an electrical component bonded to theconductive tracks, wherein the conductive tracks electrically couple theelectrical component to the touch sensor.